Low-temperature, low-loss zero level packaging techniques...

Journal of Micromechanics and Microengineering 2012 / 06 Vol. 22; Iss. 6

Low-temperature, low-loss zero level packaging techniques for RF applications by using a photopatternable dry film

Kim, J, Seok, S, Rolland, N, Rolland, P-A
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Volume:
22
Language:
english
Journal:
Journal of Micromechanics and Microengineering
DOI:
10.1088/0960-1317/22/6/065032
Date:
June, 2012
File:
PDF, 2.40 MB
english, 2012
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