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a-SiC:H low-k deposition as copper diffusion barrier layer in advanced microelectronic interconnections
C. Charles-Alfred, V. JousseaumeVolume:
201
Year:
2007
Language:
english
Pages:
4
DOI:
10.1016/j.surfcoat.2007.04.065
File:
PDF, 414 KB
english, 2007