The Texture Effect on Diffusion Barrier Property on TiN Films between Copper and Si Wafer
Sung, Dong Young, Kim, Insoo, Lee, Min Gu, Park, No Jin, Yang, Bee Lyong, Yang, Jun Mo, Ko, Jung KyuVolume:
495-497
Year:
2005
Language:
english
Journal:
Materials Science Forum
DOI:
10.4028/www.scientific.net/msf.495-497.1371
File:
PDF, 5.46 MB
english, 2005