Characterization of Sn-3.5Ag-1.0Cu Lead-Free Solder...

Advanced Materials Research 2012 / 4 Vol. 501

Characterization of Sn-3.5Ag-1.0Cu Lead-Free Solder Prepared via Powder Metallurgy Method

Yahya, Iziana, Ab Ghani, Noor Asikin, Mohd Salleh, Mohd Arif Anuar, Abd Hamid, Hamidi, Ahmad, Zainal Arifin, Mayappan, Ramani
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Volume:
501
Language:
english
Journal:
Advanced Materials Research
DOI:
10.4028/www.scientific.net/AMR.501.160
Date:
April, 2012
File:
PDF, 279 KB
english, 2012
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