Silicon Through-hole Interconnection for 3D-SiP Using Room...

Silicon Through-hole Interconnection for 3D-SiP Using Room Temperature Bonding

Tanaka, Naotaka, Yoshimura, Yasuhiro, Naito, Takahiro, Akazawa, Takashi
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Volume:
970
Language:
english
Journal:
MRS Proceedings
DOI:
10.1557/PROC-0970-Y05-01
Date:
January, 2006
File:
PDF, 3.71 MB
english, 2006
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