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A Study on Seed Damage in Plating Electrolyte and Its Repairing in Cu Damascene Metallization
Cho, Sung Ki, Lim, Taeho, Lee, Hong-Kee, Kim, Jae JeongVolume:
157
Year:
2010
Language:
english
Journal:
Journal of The Electrochemical Society
DOI:
10.1149/1.3291985
File:
PDF, 858 KB
english, 2010