An analytical thermal resistance model for calculating mean die temperature of a typical BGA packaging
Xiaobing Luo, Zhangming Mao, Jv Liu, Sheng LiuVolume:
512
Year:
2011
Language:
english
Pages:
9
DOI:
10.1016/j.tca.2010.10.009
File:
PDF, 774 KB
english, 2011