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Advanced Direct-Polishing Process Development of Non-Porous Ultralow-k Dielectric Fluorocarbon with Plasma Treatment on Cu Interconnects
Gu, Xun, Nemoto, Takenao, Tomita, Yugo, Teramoto, Akinobu, Kuroda, Rihito, Sugawa, Shigetoshi, Ohmi, TadahiroVolume:
159
Year:
2012
Language:
english
Journal:
Journal of The Electrochemical Society
DOI:
10.1149/2.049204jes
File:
PDF, 295 KB
english, 2012