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Increased Copper Outplating from Dilute HF Solutions on Microstructurally Modified Silicon Surfaces
Chen, Zhan, Lee, Seung-Mahn, Singhz, Rajiv K.Volume:
147
Year:
2000
Language:
english
Journal:
Journal of The Electrochemical Society
DOI:
10.1149/1.1393991
File:
PDF, 365 KB
english, 2000