A Study on Interfacial Reaction between Electroless Plated...

Materials Science Forum 2004 Vol. 449-452

A Study on Interfacial Reaction between Electroless Plated Ni-P/Au UBM and Sn-Bi Eutectic Solder Using AEM

Choi, J.K., Kang, H.B., Lee, J.W., Jung, Seung Boo, Yang, Cheol Woong
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Volume:
449-452
Year:
2004
Language:
english
Journal:
Materials Science Forum
DOI:
10.4028/www.scientific.net/MSF.449-452.405
File:
PDF, 2.32 MB
english, 2004
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