A comparative TCAD assessment of III-V channel materials...

IOP Conference Series Materials Science and Engineering 2015 / 02 Vol. 73

A comparative TCAD assessment of III-V channel materials for future high speed and low power logic applications

Gomes, U P, Takhar, K, Ranjan, K, Rathi, S, Biswas, D
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Volume:
73
Language:
english
Journal:
IOP Conference Series: Materials Science and Engineering
DOI:
10.1088/1757-899x/73/1/012002
Date:
February, 2015
File:
PDF, 1.19 MB
english, 2015
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