Fine Keyed Alignment and Bonding for Wafer-Level 3D ICs

MRS Proceedings 2006 / 1 Vol. 914

Fine Keyed Alignment and Bonding for Wafer-Level 3D ICs

Lee, Sang Hwui, Niklaus, Frank, McMahon, J. Jay, Yu, Jian, Kumar, Ravi J., Li, Hui-feng, Gutmann, Ronald J., Cale, Timothy S., Lu, J.-Q.
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Volume:
914
Language:
english
Journal:
MRS Proceedings
DOI:
10.1557/PROC-0914-F10-05
Date:
January, 2006
File:
PDF, 435 KB
english, 2006
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