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Modeling Material Removal Rates for Copper CMP Using Copper Nanohardness and Etch Rates
Ihnfeldt, Robin, Talbot, Jan B.Volume:
155
Year:
2008
Language:
english
Journal:
Journal of The Electrochemical Society
DOI:
10.1149/1.2940321
File:
PDF, 176 KB
english, 2008