3D Thermal Stress Model for SiC Power Modules

Materials Science Forum 2009 Vol. 600-603

3D Thermal Stress Model for SiC Power Modules

Tsao, Bang Hung, Lawson, Jacob, Scofield, James D., Laing, Clinton, Brown, Jeffery
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Volume:
600-603
Year:
2009
Language:
english
Journal:
Materials Science Forum
DOI:
10.4028/www.scientific.net/MSF.600-603.1227
File:
PDF, 703 KB
english, 2009
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