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Mechanically Induced Growth Rate Differential for Copper Layers Electroplated in Presence of Organic Additives
Başol, Bülent M., Durmuş, Ayşe, Wang, Tony, Erdemli, Serkan, Bogart, JeffVolume:
153
Year:
2006
Language:
english
Journal:
Journal of The Electrochemical Society
DOI:
10.1149/1.2223993
File:
PDF, 393 KB
english, 2006