Silicon Based System-in-Package : Breakthroughs in...

MRS Proceedings 2006 / 1 Vol. 969

Silicon Based System-in-Package : Breakthroughs in Miniaturization and ‘Nano’-integration Supported by Very High Quality Passives and System Level Design Tools

Murray, Franck, LeCornec, François, Bardy, Serge, Bunel, Catherine, Verhoeven, Jan, van den Heuvel, F.C.M., Klootwijk, J.H., Roozeboom, Fred

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Volume:

969

Language:

english

Journal:

MRS Proceedings

DOI:

10.1557/PROC-0969-W02-01-V01-01

Date:

January, 2006

File:

PDF, 279 KB

english, 2006

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