Study of Hole-Machining on Pyrex Wafer by Electrochemical...

Study of Hole-Machining on Pyrex Wafer by Electrochemical Discharge Machining (ECDM)

Liao, Yunn Shiuan, Peng, Wen Yang
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Volume:
505-507
Year:
2006
Language:
english
Journal:
Materials Science Forum
DOI:
10.4028/www.scientific.net/MSF.505-507.1207
File:
PDF, 1.44 MB
english, 2006
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