Theoretical Account for the Bimetallic Bonding of the Copper Clad Aluminum Wire by Clad-Drawing at Room Temperature
Dai, Yu Mei, Ma, Yong Qing, Dai, Yu JieVolume:
391-392
Language:
english
Journal:
Advanced Materials Research
DOI:
10.4028/www.scientific.net/AMR.391-392.37
Date:
December, 2011
File:
PDF, 515 KB
english, 2011