Theoretical Account for the Bimetallic Bonding of the...

Theoretical Account for the Bimetallic Bonding of the Copper Clad Aluminum Wire by Clad-Drawing at Room Temperature

Dai, Yu Mei, Ma, Yong Qing, Dai, Yu Jie
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Volume:
391-392
Language:
english
Journal:
Advanced Materials Research
DOI:
10.4028/www.scientific.net/AMR.391-392.37
Date:
December, 2011
File:
PDF, 515 KB
english, 2011
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