Adhesion Investigation Between Metal and Benzocyclobutene...

IEEE Transactions on Device and Materials Reliability 2014 / 9 Vol. 14; Iss. 3

Adhesion Investigation Between Metal and Benzocyclobutene (BCB) Polymer Dielectric Materials in 3-D Integration Applications

Shih, Jian-Yu, Huang, Wen-Chun, Ko, Cheng-Ta, Yang, Zheng, Hu, Sheng-Hsiang, Leu, Jihperng, Chou, Keng C., Chen, Kuan-Neng
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Volume:
14
Language:
english
Journal:
IEEE Transactions on Device and Materials Reliability
DOI:
10.1109/TDMR.2014.2343793
Date:
September, 2014
File:
PDF, 1.11 MB
english, 2014
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