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Adhesion and Reliability of Polymer/Inorganic Interfaces
Kook, S.-Y., Snodgrass, J. M., Kirtikar, A., Dauskardt, R. H.Volume:
120
Year:
1998
Language:
english
Journal:
Journal of Electronic Packaging
DOI:
10.1115/1.2792642
File:
PDF, 1.15 MB
english, 1998