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Investigation of Pad Surface Topography Distribution for Material Removal Uniformity in CMP Process
Park, Kihyun, Jeong, HaedoVolume:
155
Year:
2008
Language:
english
Journal:
Journal of The Electrochemical Society
DOI:
10.1149/1.2938378
File:
PDF, 1.34 MB
english, 2008