Novel Copper Electroless Plating Process on Ceramic...

Electrochemical and Solid-State Letters 2002 Vol. 5; Iss. 9

Novel Copper Electroless Plating Process on Ceramic Substrate Using Copper Oxide Particles

Yanagimoto, Hiroshi, Akamatsu, Kensuke, Deki, Shigehito, Gotoh, Kazuo
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Volume:
5
Year:
2002
Language:
english
Journal:
Electrochemical and Solid-State Letters
DOI:
10.1149/1.1500516
File:
PDF, 200 KB
english, 2002
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