Effect of Pd(P) thickness on the soldering reaction between...

Thin Solid Films 2015 / 06 Vol. 584

Effect of Pd(P) thickness on the soldering reaction between Sn–3Ag–0.5Cu alloy and ultrathin-Ni(P)-type Au/Pd(P)/Ni(P)/Cu metallization pad

Ho, C.E., Hsu, L.H., Yang, C.H., Yeh, T.C., Lee, P.T.
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Volume:
584
Language:
english
Journal:
Thin Solid Films
DOI:
10.1016/j.tsf.2014.12.026
Date:
June, 2015
File:
PDF, 2.74 MB
english, 2015
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