Universal solders for direct bonding and packaging of...

Materials Letters 2015 / 08 Vol. 152

Universal solders for direct bonding and packaging of optical devices

Liu, Chin-Hung, Kim, Young Jin, Chun, Dong Won, Kim, Gunwoo, Chen, Renkun, Yu, Anthony W., Jin, Sungho
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Volume:
152
Language:
english
Journal:
Materials Letters
DOI:
10.1016/j.matlet.2015.03.122
Date:
August, 2015
File:
PDF, 1.56 MB
english, 2015
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