Vacuum effect on the void formation of the molded underfill...

Microelectronics Reliability 2015 / 02 Vol. 55; Iss. 3-4

Vacuum effect on the void formation of the molded underfill process in flip chip packaging

Guo, Xue-Ru, Young, Wen-Bin
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Volume:
55
Language:
english
Journal:
Microelectronics Reliability
DOI:
10.1016/j.microrel.2014.12.001
Date:
February, 2015
File:
PDF, 4.30 MB
english, 2015
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