Using NH[sub 3] Plasma Treatment to Improve the...

Journal of The Electrochemical Society 2000 Vol. 147; Iss. 5

Using NH[sub 3] Plasma Treatment to Improve the Characteristics of Hydrogen Silsesquioxane for Copper Interconnection Application

Chang, Kow-Ming, Deng, I-Chung, Yeh, Sy-Jer, Tsai, Yao-Pin
How much do you like this book?
What’s the quality of the file?
Download the book for quality assessment
What’s the quality of the downloaded files?
Volume:
147
Year:
2000
Language:
english
Journal:
Journal of The Electrochemical Society
DOI:
10.1149/1.1393465
File:
PDF, 520 KB
english, 2000
Conversion to is in progress
Conversion to is failed