Copper-catalyzed Ullmann coupling under ligand- and...

Tetrahedron Letters 2008 Vol. 49; Iss. 12

Copper-catalyzed Ullmann coupling under ligand- and additive-free conditions. Part 2: S-Arylation of thiols with aryl iodides

Pongchart Buranaprasertsuk, Joyce Wei Wei Chang, Warinthorn Chavasiri, Philip Wai Hong Chan
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Volume:
49
Year:
2008
Language:
english
Pages:
3
DOI:
10.1016/j.tetlet.2008.01.060
File:
PDF, 114 KB
english, 2008
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