Study of the cross contamination effect on post CMP in situ...

Microelectronic Engineering 2015 / 03 Vol. 136

Study of the cross contamination effect on post CMP in situ cleaning process

Kim, Hong Jin, Bohra, Girish, Yang, Hyucksoo, Ahn, Si-Gyung, Qin, Liqiao, Koli, Dinesh
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Volume:
136
Language:
english
Journal:
Microelectronic Engineering
DOI:
10.1016/j.mee.2015.03.033
Date:
March, 2015
File:
PDF, 1.23 MB
english, 2015
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