Lead-Free Solder System Bi5-Ag3-Cu0.5-Sn Prepared by...

Journal of Metastable and Nanocrystalline Materials 2005 Vol. 24-25

Lead-Free Solder System Bi5-Ag3-Cu0.5-Sn Prepared by Mechanical Alloying

Carreño-Gallardo, Caleb, Estrada-Guel, Ivanovich, Neri-Flores, Miguel, Martínez-Sánchez, Roberto
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Volume:
24-25
Year:
2005
Journal:
Journal of Metastable and Nanocrystalline Materials
DOI:
10.4028/www.scientific.net/JMNM.24-25.451
File:
PDF, 445 KB
2005
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