The Effect of Oxygen on Adhesion of Thin Copper Films to...

The Effect of Oxygen on Adhesion of Thin Copper Films to Silicon Nitride

Pang, Mengzhi, Backhaus-Ricoult, Monika, Baker, Shefford P.
How much do you like this book?
What’s the quality of the file?
Download the book for quality assessment
What’s the quality of the downloaded files?
Volume:
795
Language:
english
Journal:
MRS Proceedings
DOI:
10.1557/PROC-795-U3.6
Date:
January, 2003
File:
PDF, 115 KB
english, 2003
Conversion to is in progress
Conversion to is failed