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The Effect of Oxygen on Adhesion of Thin Copper Films to Silicon Nitride
Pang, Mengzhi, Backhaus-Ricoult, Monika, Baker, Shefford P.Volume:
795
Language:
english
Journal:
MRS Proceedings
DOI:
10.1557/PROC-795-U3.6
Date:
January, 2003
File:
PDF, 115 KB
english, 2003