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Investigation of the Adhesion of Electroless Copper to Glass Substrates
Cui, Xiaoyun, Hutt, David A., Conway, Paul P.Volume:
1113
Language:
english
Journal:
MRS Proceedings
DOI:
10.1557/PROC-1113-F03-16
Date:
January, 2008
File:
PDF, 451 KB
english, 2008