Thermal Cycling Effects on Critical Adhesion Energy and...

Journal of The Electrochemical Society 2005 Vol. 152; Iss. 4

Thermal Cycling Effects on Critical Adhesion Energy and Residual Stress in Benzocyclobutene-Bonded Wafers

Kwon, Yongchai, Seok, Jongwon, Lu, Jian-Qiang, Cale, Timothy S., Gutmann, Ronald J.
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Volume:
152
Year:
2005
Language:
english
Journal:
Journal of The Electrochemical Society
DOI:
10.1149/1.1869252
File:
PDF, 1.03 MB
english, 2005
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