Residual Stresses and Void Kinetics in AlSiC MMCs during...

Materials Science Forum 2008 Vol. 571-572

Residual Stresses and Void Kinetics in AlSiC MMCs during Thermal Cycling

Schöbel, Michael, Requena, Guillermo C., Kaminski, Heinz, Degischer, H. Peter, Buslaps, Thomas, di Michiel, Marco
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Volume:
571-572
Year:
2008
Language:
english
Journal:
Materials Science Forum
DOI:
10.4028/www.scientific.net/MSF.571-572.413
File:
PDF, 1.34 MB
english, 2008
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