Evaluation of the Mechanical Properties of Copper Thin Film...

Applied Mechanics and Materials 2011 / 10 Vol. 117-119

Evaluation of the Mechanical Properties of Copper Thin Film and Copper Bulk at the Nano-Scale by Nanoindenter

Huang, Jen Ching, Weng, Yung Jin
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Volume:
117-119
Language:
english
Journal:
Applied Mechanics and Materials
DOI:
10.4028/www.scientific.net/AMM.117-119.394
Date:
October, 2011
File:
PDF, 414 KB
english, 2011
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