A chemical mechanical polishing model incorporating both...

Thin Solid Films 2004 Vol. 446; Iss. 2

A chemical mechanical polishing model incorporating both the chemical and mechanical effects

Kuide Qin, Brij Moudgil, Chang-Won Park
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Volume:
446
Year:
2004
Language:
english
Pages:
10
DOI:
10.1016/j.tsf.2003.09.060
File:
PDF, 344 KB
english, 2004
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