Growth of copper metal by atomic layer deposition using...

Thin Solid Films 2004 Vol. 458; Iss. 1-2

Growth of copper metal by atomic layer deposition using copper(I) chloride, water and hydrogen as precursors

Tobias Törndahl, Mikael Ottosson, Jan-Otto Carlsson
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Volume:
458
Year:
2004
Language:
english
Pages:
8
DOI:
10.1016/j.tsf.2003.12.063
File:
PDF, 545 KB
english, 2004
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