Investigation of Ta grain boundary diffusion in copper by...

Thin Solid Films 2004 Vol. 459; Iss. 1-2

Investigation of Ta grain boundary diffusion in copper by means of Auger electron spectroscopy

G Erdélyi, G Langer, J Nyéki, L Kövér, C Tomastik, W.S.M Werner, A Csik, H Stoeri, D.L Beke
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Volume:
459
Year:
2004
Language:
english
Pages:
5
DOI:
10.1016/j.tsf.2003.12.125
File:
PDF, 128 KB
english, 2004
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