New metal layers for integrated circuit manufacture:...

New metal layers for integrated circuit manufacture: experimental and modeling studies

N. Iwamoto, N. Truong, E. Lee
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Volume:
469-470
Year:
2004
Language:
english
Pages:
7
DOI:
10.1016/j.tsf.2004.06.176
File:
PDF, 378 KB
english, 2004
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