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The thermal stability of Cu/FSG structure with amorphous and crystalline tantalum nitride diffusion barriers
Ching-Chun Chang, J.S. ChenVolume:
469-470
Year:
2004
Language:
english
Pages:
6
DOI:
10.1016/j.tsf.2004.08.138
File:
PDF, 803 KB
english, 2004