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Characterizing metallurgical reaction of Sn–Pb solder with Ni/Cu under-bump metallization by electron microscopy
Li-Yin Hsiao, Jenq-Gong DuhVolume:
469-470
Year:
2004
Language:
english
Pages:
6
DOI:
10.1016/j.tsf.2004.08.152
File:
PDF, 394 KB
english, 2004