Cu-penetration induced breakdown mechanism for a-SiCN

Cu-penetration induced breakdown mechanism for a-SiCN

C.W Chen, P.T. Liu, T.C. Chang, J.H. Yang, T.M. Tsai, H.H. Wu, T.Y. Tseng
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Volume:
469-470
Year:
2004
Language:
english
Pages:
5
DOI:
10.1016/j.tsf.2004.08.161
File:
PDF, 272 KB
english, 2004
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