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Structural characteristics and interfacial reactions of low dielectric constant porous polysilazane for Cu metallization
J.H. Wang, P.T. Liu, T.S. Chang, T.C. Chang, L.J. ChenVolume:
469-470
Year:
2004
Language:
english
Pages:
5
DOI:
10.1016/j.tsf.2004.09.014
File:
PDF, 365 KB
english, 2004