A chemical kinetics model to explain the abrasive size...

A chemical kinetics model to explain the abrasive size effect on chemical mechanical polishing

Ping Hsun Chen, Bing Wei Huang, Han-C Shih
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Volume:
476
Year:
2005
Language:
english
Pages:
7
DOI:
10.1016/j.tsf.2004.09.049
File:
PDF, 242 KB
english, 2005
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