Application of plasma immersion ion implantation on seeding...

Thin Solid Films 2005 Vol. 478; Iss. 1-2

Application of plasma immersion ion implantation on seeding copper electroplating for multilevel interconnection

Shao-Yu Chiu, Ying-Lang Wang, Shih-Chieh Chang, Ming-Shiann Feng
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Volume:
478
Year:
2005
Language:
english
Pages:
6
DOI:
10.1016/j.tsf.2004.11.187
File:
PDF, 558 KB
english, 2005
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