Mechanism for Cu void defect on various electroplated film...

Thin Solid Films 2006 Vol. 498; Iss. 1-2

Mechanism for Cu void defect on various electroplated film conditions

H.P. Feng, M.Y. Cheng, Y.L. Wang, S.C. Chang, Y.Y. Wang, C.C. Wan
How much do you like this book?
What’s the quality of the file?
Download the book for quality assessment
What’s the quality of the downloaded files?
Volume:
498
Year:
2006
Language:
english
Pages:
4
DOI:
10.1016/j.tsf.2005.07.062
File:
PDF, 268 KB
english, 2006
Conversion to is in progress
Conversion to is failed