Effect of grain growth stress and stress gradient on...

Thin Solid Films 2006 Vol. 504; Iss. 1-2

Effect of grain growth stress and stress gradient on stress-induced voiding in damascene Cu/low-k interconnects for ULSI

Jong-Min Paik, Il-Mok Park, Young-Chang Joo
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Volume:
504
Year:
2006
Language:
english
Pages:
4
DOI:
10.1016/j.tsf.2005.09.013
File:
PDF, 138 KB
english, 2006
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