Defect analysis of thin film Si-based alloys deposited by...

Thin Solid Films 2008 Vol. 516; Iss. 5

Defect analysis of thin film Si-based alloys deposited by hot-wire CVD using junction capacitance methods

J. David Cohen, Shouvik Datta, Kimon Palinginis, A.H. Mahan, Eugene Iwaniczko, Yueqin Xu, Howard M. Branz
How much do you like this book?
What’s the quality of the file?
Download the book for quality assessment
What’s the quality of the downloaded files?
Volume:
516
Year:
2008
Language:
english
Pages:
7
DOI:
10.1016/j.tsf.2007.06.116
File:
PDF, 714 KB
english, 2008
Conversion to is in progress
Conversion to is failed