Analyses of interface adhesion between porous SiOCH low-k...

Thin Solid Films 2008 Vol. 516; Iss. 16

Analyses of interface adhesion between porous SiOCH low-k film and SiCN layers by nanoindentation and nanoscratch tests

Shou-Yi Chang, Hung-Chun Tsai, Jien-Yi Chang, Su-Jien Lin, Yee-Shyi Chang
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Volume:
516
Year:
2008
Language:
english
Pages:
5
DOI:
10.1016/j.tsf.2007.07.043
File:
PDF, 652 KB
english, 2008
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