Enhanced adhesion of plasma-sputtered copper films on...

Enhanced adhesion of plasma-sputtered copper films on polyimide substrates by oxygen glow discharge for microelectronics

Y.-S. Lin, H.-M. Liu
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Volume:
516
Year:
2008
Language:
english
Pages:
8
DOI:
10.1016/j.tsf.2007.07.162
File:
PDF, 931 KB
english, 2008
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