Stress relaxation during isothermal annealing in...

Thin Solid Films 2008 Vol. 516; Iss. 21

Stress relaxation during isothermal annealing in electroplated Cu films

Soo-Jung Hwang, Young-Chang Joo, Junichi Koike
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Volume:
516
Year:
2008
Language:
english
Pages:
7
DOI:
10.1016/j.tsf.2008.03.030
File:
PDF, 1020 KB
english, 2008
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